Hard Surface Process Chemistry Products


PPD-455 Positive Photoresist Developer: An extremely high resolution, high speed, and high contrast developer with maximized buffering to stabilize the formula in storage, and use for extended life. Works well with most AZ type photoresists and we will customize the concentration for customer process needs. This formula minimizes strippage of unexposed photoresist to maximize contrast. The maximum resolution in production operation is down to 0.4µ (micron) images within 0.6µ of photoresist.
PPD-450 Positive Photoresist Developer: An extremely high resolution, high contrast developer with maximized buffering to stabilize the formula in storage, and use for extended life. Works well with most AZ type photoresists and we will customize the concentration for customer process needs. This formula minimizes strippage of unexposed photoresist to maximize contrast. The maximum resolution in production operation is down to 0.4µ (micron) images within 0.6µ of photoresist.
PPD-440 Positive Photoresist Developer: A high speed, high contrast positive photoresist developer designed to be used in general photolithography where images are 1.0µ and larger.
*CEP-200 Chrome Etchant: Approx. etch rate, (Angstroms/sec): 22Å/sec
PRS-100 Positive Photoresist Stripper: Ambient stripper, Recommended strip time: 5 minutes
FO-100 Iron Oxide Etchant: Approx. etch rate, (Angstroms/sec): Sputtered Film - 135Å/sec; CVD Film - 200Å/sec. Recommended to be used at ambient temperatures with gentle agitation. Etchant must be replenished with use if continued use is required.

TECHNICAL NOTE:

* All chemistry is recommended to be used full strength at ambient temperatures with gentle agitation. Do NOT place in metal containers, Plastic only. Note: All of our chemistry products are manufactured with DI filtered water and final filtered at 0.1 micron.